根据彭博，苹果显然正在试图在内部设计更多的芯片组件，据报道，该公司建立了一个新办公室，其目标是更换现在来自Broadcom和Skyworks的组件。
While the A-series and M-series SoCs, which contain the CPU and GPU for Apple’s iPhones and Macs, receive the most attention, there is a slew of other chips within those devices that handle power management, USB connectivity, wireless charging, and more. Skyworks and Broadcom offer a major chunk of the iPhone’s third-party circuitry, according to iFixit’s iPhone 13 pro deconstruction — pieces that Apple appears to prefer to design on its own to create more bespoke solutions for its hardware.
根据彭博社的说法，新办公室将首先关注“无线收音机，射频集成电路和芯片上的无线系统”，以及“连接到蓝牙和Wi-Fi的半导体”。
苹果开发更多自己的处理器的愿望可能是由对更大的控制和硬件集成的渴望而动的，也可能是由于改善零件供应的愿望而动机。苹果已经遭受了当前全球芯片短缺的影响，诸如Broadcom这样的供应商的零件挑战迫使该公司于10月削减其制造计划。如果苹果可以继续与其制造合作伙伴成功合作，那么建立自己的芯片可以帮助苹果在将来缓解其中的一些挑战。
iPhone的调制解调器现在由高通公司制造，是第三方筹码最明显的例子之一（但以前是一场长达一年的法律斗争的主题，短暂地看到Apple转换为使用Intel Parts）。Apple has made no secret of its desire to develop its own 5G semiconductors rather than paying for Qualcomm’s: in 2019, the company paid $1 billion for Intel’s smartphone modem division, and it is expected to transition to its own in-house modems for the iPhone as early as 2023.
